Could I help you?
New Reduced price! View larger

IEC 63251 Ed. 1.0 b:2023

M00010680

New product

IEC 63251 Ed. 1.0 b:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

standard by International Electrotechnical Commission, 11/01/2023

More details

In stock

$81.70

-57%

$190.00

More info

Full Description

This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.