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IPC 2511BGeneric requirements for implementation of product manufacturing description data and transfer methodologystandard by Association Connecting Electronics Industries, 01/01/2002
IPC 2547Sectional Requirements for Shop Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Reworkstandard by Association Connecting Electronics Industries, 01/01/2002
IPC A-620Requirements & Acceptance for Cable & Wire Harness Assembliesstandard by Association Connecting Electronics Industries, 01/01/2002
IPC 9701Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachmentsstandard by Association Connecting Electronics Industries, 01/01/2002
IPC 2576Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Data eXchange (PDX)standard by Association Connecting Electronics Industries, 11/01/2001
IPC 4103Specification for Base Materials for High Speed/High Frequency Applicationsstandard by Association Connecting Electronics Industries, 01/01/2002
IPC 2578Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data - Product Data eXchangestandard by Association Connecting Electronics Industries, 11/01/2001
IPC 2571Generic Requirements for Electronic Manufacturing Supply Chain Communication - Product Data eXchange (PDX)standard by Association Connecting Electronics Industries, 11/01/2001
IPC 2546Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly - with Amendments 1 & 2standard by Association Connecting Electronics Industries, 10/01/2001
IPC 2541Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX)standard by Association Connecting Electronics Industries, 10/01/2001
IPC DLS-2001Technical Proceedings for the Designers Learning Symposium - 2001Conference Proceeding by Association Connecting Electronics Industries, 07/18/2001
IPC TR-486Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separationsstandard by Association Connecting Electronics Industries, 07/01/2001